Articels and Technical Document
Laser Direct Structuring
3D LDS Components: New Opportunities in PCB Layout and Production
By Malte Borges
September 2014
Space Saver
February 2014
What are molded interconnect devices?
Jaunary 2014
LPKF Researches Develop Powder Coating for Molded Interconnect Devices
May 2013
Using Laser Direct Structuring (LDS) to Create Robust Hardware Security Devices
Oktober 2012
3D LDS Components for New Production Opportunities
February 14, 2012
Molex transfer 3D electronics to medical devices
November 7th, 2011
Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect Devices
By Marc Dressler
March 29, 2010
3D LDS Components for New Production Opportunities
By Wolfgan John
October 2010
CONNECTORS & CORDS: Laser Lays it On
By Mary Lowe
Apliance Design Magazine, February 1, 2006
Technical Papers
Manufacturing of Molded Interconnect Devices from Prototyping to Mass Production with Laser Direct Structuring
By Nils Heininger, Dr. Wolfgang John I & T and Hans-Jürgen Boßler
Presented at the MID Congress 2004, Erlangen, Germany
Laser-based production of multifunction packages taking innovative rotary encoders for automation and vehicle technology as examples
By Nils Heininger, Dirk Ahrendt, Wolfgang Eberhardt, Heinz Krück, Lars Blassmann, Christoph Hanisch and Stephan Schauz
Presented at MID Meeting 2004 Japan
Developing molded interconnect device components is a challenging procedure no matter which process or technology is used. This LDS MID Design Guide helps interdisciplinary developers produce MIDs based on the LPKF laser direct structuring process.
Topics include:
- Injection molding design rules
- Tool design
- Data prep for laser processing
- Metallization process rules
- Thermal conditioning
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