For Advanced Packaging, Co-Packaged Optics and processes related to high-volume manufacturing of glass wafer and panel technology.
Precision Glass Processing (LIDE – Laser Induced Deep Etching)
More than 50 years of experience in innovation and laser manufacturing contribute to the development of the most powerful, precise, and efficient solutions on the market.
Advanced systems for rapid in-house PCB prototyping and micro material processing – accelerating innovation from concept to working prototype.