ProtoMat D104

ProtoMat D104

Milling and Laser Prototyping in One System

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The ProtoMat D104's integrated UV laser separates it from traditional milling machines by extending the range of possible applications. With a focused laser beam spot size of just 15 µm, PCB track widths of 50 µm and spaces of 30 µm can be achieved depending on copper thickness, substrate type and peel strength; 4 mil traces and spacing or larger are completed without use of the laser etching tool.

An intelligent control system and advanced CircuitPro software determine independently when either the precise laser or the faster mechanical tools will be used, depending on the board layout.

The ProtoMat D104 can structure a wide variety of circuit board materials, including FR4, high frequency/RF materials, fired ceramics, and more. This makes the D104 ideal for those working with analog, digital, RF, or microwave designs. View the datasheet or browse the application images and media section to learn more.

Software Package

LPKF CircuitPro software is included with easy to follow processing guide wizards and updated GUI. This simplifies the process of arriving at a completed design with the machine prompting the operator during each milling, drilling and cutting stage. A comprehensive parameter library for many commonly used materials supports the users in their own projects.

ProtoMat Engineering

The LPKF ProtoMat PCB milling systems utilize the highest quality stepper motors, spindle motors and H-shaped guide rails mounted to a durable frame to ensure pristine milling, drilling and cutting quality for years of operation. Spindle runout below 5µm and an internal calibration completed on each machine is standard with over 40 years of German engineering experience applied in development of each model.

Technical Specifications: ProtoMat D104

Part Number 10030011
Max. Material size and layout area (X/Y/Z) 305 mm x 229 mm, 10 mm (12" x 9" x 0.4")
Resolution (X/Y) 1 µm (0.04 mil)
Repeatability 1 µm (0.04 mil)
Diameter of focused laser beam 15 µm (0.6 mil)
Milling Spindle Max. 100,000 rpm, software controlled
Tool Change Automatic, 15 positions
Laser structuring rate 1 mm/s on 18 µm Cu (0.04")
Laser Power Output 100 mW
Drilling Speed 100 strokes/min
Travel Speed (X/Y) 100 mm (3.7")
Laser Wavelength UV Range
Software LPKF Circuitpro (included)
Features Vision system for optical fiducials/width monitoring, status light, vacuum table, pneumatic working depth limiter
Dimensions (W x H x D) incl. hood opening 660 mm x 700 mm x 870 mm (26" x 27.6" x 34.3")
Weight <100 kg (220.5 lbs)
Operating Conditions  
Power Supply 85 V- 260 V AC, 50-60 Hz, 440 W/td>
Compressed Air Supply 6 bar/ <100 l/min (87 psi/< 3.5 cfm)
Ambient temperature 22 °C ± 2 °C (71.6 °F ± 4 °F
Required Accessories PC, Dust Extraction
Technical specifications subject to change.
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