Universal Usability in the Lab
- Intuitive operation
- Broad processing range due to UV laser
- Vision system
- Output measurement at substrate level
Micro Machining in the Lab
UV laser source as a versatile tool
The LPKF ProtoLaser U4 uses a scanner-guided laser with a wavelength of 355 nm in the UV spectrum, that has been specially developed for use in electronics laboratories. This wavelength makes it possible for many material groups to be perfectly processed with the laser without additional tools, masks or films.
Placing scan fields next to each other results in a working range of up to 229 mm x 305 mm x 10 mm. The laser focus with a diameter of approx. 20 µm allows for structures with a pitch of 65 µm (50 µm line width, 15µm apart) related to FR4 with 18 µm Cu.
Powerful system software
The user-friendly LPKF CircuitPro PL system software gives access to all important process parameters. A comprehensive parameter library that not only includes many common but also exotic materials provides assistance for the operator's own projects.
Stabilization in the low-energy range
Fine, sensitive processes require very little laser energy. The new UV laser source is designed accordingly and is stable over a wide power range. This benefits applications with particularly thin layers or delicate materials.
A power measuring field determines the actual power of the laser when in focus position. This results in accurate actual data for documenting the production process.
The LPKF ProtoLaser U4 uses a newly designed, fast vision system optimized for laser micromachining. The camera and the image recognition process capture fiducials or geometric structures on the substrate to be processed.
Applications - ultra-fine structures on challenging substrates
Low Temperature Cofired Ceramics (LTCC) are thin ceramics in unfired condition. They are used, for example, for multilayer circuits or serve as resistant carriers for components after sintering. Processing is difficult because LTCC is sensitive to mechanical influences - a steep template for the laser.
The laser beam can not only precisely remove the metallic surface layers, but also cut and drill the substrate material. Depending on the material, several laser pulses are required - the CircuitPro PL CAM software has an extensive parameter library for many common materials.
Processing a RF Filter with the LPKF ProtoLaser U4
LPKF systems for Laser Structuring
Thanks to the specific wavelength of the UV laser, the ProtoLaser U4 can structure, engrave and cut materials in a single operation. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.
Laser ablation with practically no heat transfer: The shorter the processing pulse, the less heat is transferred to the adjacent material. The picosecond laser of the ProtoLaser R4 clears - an important hurdle falls: There is no more heat transfer to speak of, with the material struck by the laser evaporating right away.
The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.
The Tabletop system enables efficient prototyping of digital and analog circuits, RF and microwave PCBs -- even for multilayer PCBs. It achieves precise geometries on virtually any material with the laser tool. Precise drilling and milling even of thick substrates using mechanical drilling.