The new benchmark for smallest apertures
- Perfectly suited for wafer stencils
- High and stable precision
- Exceptionally efficient production
- Optimal quality
Benefits MicroCut 6080
The uncomplicated programming and parameter search makes it easy to overcome previously existing process limits and to meet increasing market requirements.
Most modern positioning and cutting technology
MicroCut 6080 is specifically designed to meet the requirements of small apertures and enables cutting of precise apertures as small as 18 μm on the laser input side and 10 μm on the output side.
|Working range||600 mm x 800 mm (23.6” x 31.5”)|
|Max. frame size||740 mm x 1800 mm x 40 mm (29.1” x 70.9” x 1.6”)*|
|Axis accuracy||±2 µm|
|Max. material thickness||up to 1 mm|
|System demensions (W x H x D)||1530 mm x 1920 mm x 1625 mm (61” x 75” x 64”)|
|Weight||ca. 2200 kg|
LPKF Laser Systems for SMT Stencils and Precision Parts (pdf - 878 KB)