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PCB Laser Depaneling

Reduce Stress and increase yield with LPKF MicroLine Laser Systems

When time to market is the driving force, fast alternatives to pilot production runs can be the key to success.

LPKF laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time, increasing accuracy and eliminating tooling costs these systems simply produce a better product at a lower cost.

LPKF MicroLine Laser Systems

Problems lasers can eliminate

  • Compromised yield
  • Mechanical stress to the foil or circuit
  • Die misalignment
  • Damaged components
  • Fractured boards
  • Contamination of the work piece

Benefits of laser depaneling

  • No mechanical stess
  • Limited debris
  • Minimized thermal stress
  • Cut any material: rigid, flex, or rigid-flex
  • Low operating cost

Economical advantages

All LPKF laser systems work directly from CAD data, and require no specific tooling. In many cases, the savings in tooling costs can cover the cost of a laser system in less than 10 months - depending on the tools needed per year. With easy handling and short changeover times our laser depaneling systems offer economical solutions to compete in today's on-demand world.

LPKF MicroLine 2000 Ci

Typical UV Laser Applications

  • Depaneling flex and rigid PCBs
  • Cover layer cutting
  • Cutting fired and unfired ceramics
  • Microvia drilling
  • Skiving (cover layer removal)
  • Pocket creation
  • Metal ablation (for circuit board creation)