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MICROLINE 2000

No Stress. No Burrs. No Particles.

MicroLine 2000

The low-cost answer to depaneling bare or populated, rigid and flexible printed circuit boards. The MicroLine 2000 offers all of the advantages of laser technology including:

  • Optimal utilization of the substrate
  • Precision cutting of complex contours
  • Low cost, energy, and space requirements

In addition to PCB depaneling technology, LPKF also showcases laser systems which are designed for the creation of SMT solder stencils, micro-via drilling, 3D-MIDs, and plastic welding lasers.