ProtoLaser S

ProtoLaser U3

Ultra-fast, advanced PCB laser etching

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The ProtoLaser U3 is an ultraviolet laser system with a 20 µm focused beam diameter for processing printed circuit boards. Winner of a SMT Vision Award, the ProtoLaser U3 can etch circuitry, drill holes, and depanel PCBs all in a single step.

The system works straight from CAD data to process boards with laser paths generated within LPKF CircuitPro software. Circuit traces as small as 75 µm (3 mil) can be achieved with laminated PCB materials and 50 µm traces with spacing of ~20 µm with Alumina/fired ceramics. Smaller features may be possible and results are dependent on copper/metal thickness, substrate type and peel strength. The system's advanced speed allows it to be used not only for R&D but also on-demand production.

Thanks to the high photon energy and low-stress nature of UV lasers, the ProtoLaser U3 can laser etch, drill and cut a wide variety of PC board substrates: FR4, fired ceramics, green and co-fired LTCC, flexible and rigid-flex materials, transparent conductive oxide (TCO), PET, and high-frequency RF and microwave materials (Rogers TMM®, RT/duroid®, RO4000® series, etc.).

Technical Specifications: ProtoLaser U3

Part Number 10011576
Max. Material size and layout area (X/Y/Z) 229 x 305 x 10 mm (9” x 12” x 0.4”)
Repeatability ± 2 µm (± 0.08 mil)a
Diameter of focused laser beam 15 µm (0.8 mil)
Accuracy 2 µm (0.08 mil)
Laser Wave Length 355 nm
Dimensions (W x H x D) 875 mm x 1430 mm x 750 mm (34.5" x 56.3" x 29.5")
Laser pulse frequency 10–100 kHz
Machine dimensions (W x H x D) 875 mm x 1,430 mm x 750 mm (34.5” x 56.3” x 29.5”)b
Machine weight 260 kg (573 lbs)
Operating Conditions  
Power Supply 110/230 V, 50-60 Hz, 1.4 kW
Compressed Air Supply 8 bar (116 psi), 160 l/min (5.66 cfm)
Cooling Air cooled (internal cooling cycle)
Ambient temperature 22 °C ± 2 °C (68 °F ± 4 °F)
Required Accessories Exhaust unit, air compressor*
Software Microsoft Windows 2000/XP/7, 700 MHz processor or higher, min. 512 MB RAM (1GB recommended), screen resolution min. 1024 x 768 pixels, USB 2.0
a    This value reflects direct repeated movements of the laser beam
b    Height with open working door 1730 mm (68.1”)
*    Required only when working with laminated materials
Technical specifications subject to change.
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