ProtoLaser R

ProtoLaser R

Laser Structuring with Ultrafast Laser Source

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Laser Ablation with Virtually No Heat Input

In laser technology, the shorter the pulse, the lower the heat input into the surrounding material. A picosecond laser breaks down an important barrier. It practically eliminates heat transfer; the targeted material evaporates immediately.

Proven Housing

The new ProtoLaser R is packaged in the familiar thirdgeneration ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door.

Micro-Material Processing Specialist

Unlike pure cutting applications, micro material processing does not require high powers. Instead, stable laser parameters in the lower output range are crucial. The LPKF ProtoLaser R features a laser source with a laser power of up to 4 W. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.

Established System Software

The LPKF ProtoLaser R comes with tried and true system software. Support of all common CAD formats is enabled through the combination of LPKF CircuitPro and LPKF CircuitMaster.

  • Picosecond laser for the research lab
  • Cold ablation of different thin-film-layers
  • Intuitive CAM software
  • Field-proven housing concept

Technical Specifications: ProtoLaser R

Max. material size and layout area
(X x Y x Z)
229 x 305 x 10 mm
( 9” x 12 “ x 0.4” )
Laser wavelength 1 030 nm
Laser pulse frequency Max. 200 kHz
Laser pulse duration 1 ps
Laser power Max. 3.73 W
Laser spot diameter in focus position 15 μm (0.6 mil)
Table move speed (X x Y x Z) 100 x 100 x 10 mm/s
(4”/s x 4”/s x 0.4”/s)
Dimensions (W x H x D) 875 x 1 430 x 820 mm
(34.5” x 56.3” x 32.3”)
Weight 280 kg
Electrical consumption 110 V - 230 V; 1.4 kW
Required accessories PC, Exhaust unit, compressor
Technical specifications subject to change.
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