Correct aperture size is vital to achieve optimum paste release for SMT solder printing. The manufacturing method of a stencil will greatly influence aperture ratio in this regard and with 60-75% of all board assembly problems stemming from solder paste printing, it is vital for stencil buyers to understand how well their suppliers' processes and methods work.
This new webinar from LPKF explores stencil aperture size in relation to the 4M rule of manufacturing: methods, machines, materials, and manpower. A thorough study of 16 stencils was conducted, including Cp and Cpk analysis. Don't miss this insightful presentation!