ProtoFlow S N2

ProtoFlow S4

Lead-Free Reflow Oven ideal for in-house Rapid PCB Prototyping

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The LPKF ProtoFlow S4 is a convection oven for lead-free reflow soldering. It is a key component in rapid SMD prototyping and small batch production. Compact and versatile, the ProtoFlow S4 offers a large working and microprocessor-controlled temperature/time profiles. The LPKF ProtoFlow S4 is excellent for SMD Reflow soldering, adhesive hardening by precipitation, hardening by precipitation of conductive paste for plated-through holes, and other thermal procedures. Active cooling at the end of the soldering process with the chamber closed prevents uncontrolled temperature fluctuations in the material..

  • Lead-free Reflow Process
  • Preprogrammed with industry standard profiles
  • Four thermocouples ensure perfect heat distribution
  • Any custom temperature profiles and process times can be set in the software
  • Integrated USB communication port for easy programming of reflow profiles and process recording and analysis
  • USB connectivity

Lighted Process Chamber

Visually monitoring of the process is made possible by the large inspection window in the door. Integrated interior lighting reveals the status of the soldering process and allows for on-the-fly job modification where needed to optimize the reflow process.

Technical Specifications: ProtoFlow S4

Max. PCB size 320 mm x 220 mm (12.6” x 8.6”)
Max. reflow temperature 290 °C (554 °F)
Outlet tube for active cooling Outlet tube for active cooling
Time for temperature stabilization 220 °C, 64 h
Temperature Stabilization time <5 min
Ambient temperature 0 – 40 °C (32 – 104 °F)
Power Supply 230 V, 50/60 Hz, single-phase 3.5 kW
Dimensions (W x D x H) 555 mm x 480 mm x 300 mm (21.7” x 18.9” x 11.8”)
Weight 38 kg (83.8 lbs)
Required software Windows 10
Technical specifications subject to change.
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