Microvia drilling is a means of creating holes between conductive layers of a printed circuit board (PCB) which are then typically electroplated to create a conductive path through the substrate to connect 2 or more layers of circuitry.
A UV laser is used to drill through copper and substrate layers by using precisely controlled laser parameters (power, frequency, pulse width, etcetera) in order to optimize the drilling performance for the different material types in a laminated PCB stack-up.
The most common PCB materials which require microvia drilling are flexible circuits composed of an organic polyimide substrate bonded between conductive copper layers to provide electrical insulation between the two conducting copper layers.
Traditional rigid PCBs and High Density Interconnect devices also require plated microvias for connecting to internal layers.
LPKF’s Microline 5000 series is the flex PCB industry’s answer to high throughput, high-yield drilling applications. Common applications include the drilling of through-holes and blind vias, with the additional ability to cut large mounting holes, or full perimeter cuts of irregular board contours.
LPKF’s new generation of microvia drilling lasers are achieving throughput speeds never before seen in the industry. New drilling techniques are being employed to improve this existing, but long-neglected method.
The historical industry leader has not done much to improve the technology for years – LPKF is changing that.
Laser market leaders don’t always treat their small customers well. Many industry leaders jump at the chance to work with Flextronics, Foxconn, or Apple, meanwhile, smaller customers are often neglected. With a world-wide service network, LPKF customers can speak to a live support technician anytime, 24/7.
There is no laser with a better price/performance ratio on the world-wide market today.