UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required. In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.
The MicroLine 2000 P can be customized to fit your applications. It is able to be equipped with either a 15 or 27 watt nanosecond UV or 36 Watt nanosecond green laser source. An exhaust unit removes all material evaporated by the laser energy, ensuring board surfaces are residue-free.
The LPKF MicroLine 2000 Ci is ideal for anyone who needs a versatile, efficient depaneling method in an in-line automated production environment. Powered by the same available laser sources as the P model which make clean, burr-free cuts, MicroLine 2000 Ci systems eliminate mechanical stress and greatly limit thermal stress. This makes the MicroLine 2000 Ci perfect for depaneling any substrate - from FR4 to ceramics, polyesters, and more.
The MicroLine 2000 Ci can be customized to fit your applications. Its inline chassis and can be equipped with either a 15 or 27 watt nanosecond UV or 36 Watt nanosecond green laser source. An exhaust unit removes all material evaporated by the laser energy, ensuring board surfaces are residue-free. The built-in SMEMA interface allows users to add external loaders and/or conveyors of their choice (handling equipment as shown above is not included).
|Manual (P)||Automated (Ci)|
|Max. Working Area||350 mm x 350 mm x 11 mm||350 mm x 250 mm x 11 mm|
|Positioning accuracy||+/- 25 µm|
|Diameter of focussed laser beam||20 µm|
|System dimensions (W x H x D)||875 mm x 1550 mm (2000 mm)* x 1120 mm|
|Weight||ca. 450 kg|