Characterized by a compact outer design the CuttingMaster 2000 offers a range of different laser powers and wavelengths for a working area of up to 350 mm x 350 mm. The cost-effective system is capable to use LPKFs CleanCut technology which guarantees a maximum technical cleanliness of the cutting edges.
The UV laser system is ideal for cutting flexible, rigid-flexible and rigid printed circuit boards. Users benefit from the advantages of laser technology: the cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress. The systems of the LPKF CuttingMaster series are easy to operate thanks to the sophisticated, integrated software. In addition, the compact machines offer a convincing price comparable to that of mechanical cutting systems - without compromising quality, efficiency or flexibility.
The LPKF CuttingMaster 2000 series makes depaneling a simple job: The layout files are easily transferred to the machine at the click of a mouse - without lengthy changeover times or previous time-consuming tool production.
|Manual (P)||Automated (Ci)|
|Max. Working Area||350 mm x 350 mm x 11 mm||350 mm x 250 mm x 11 mm|
|Positioning accuracy||+/- 25 µm|
|Diameter of focussed laser beam||< 20 µm|
|System dimensions (W x H x D)||875 mm x 1510 mm (2070 mm)* x 1125 mm|
|Weight||ca. 450 kg|
|Laser power||Wavelength||Pulse duration||3000 series||CleanCut|
|15 W||355 nm (UV)||nano second||2115||-|
|27 W||355 nm (UV)||nano second||2127||X|
|32 W||532 nm (green)||nano second||2232||X|