LPKF MicroLine 2000

UV laser cutting systems


The LPKF MicroLine family of laser depaneling systems is ideal for cutting out populated or bare circuits on any rigid, flexible, or rigid-flex substrate.

Precise UV laser beams eliminate mechanical stress and reduce thermal stress, enabling small subassemblies with higher densities to be realized. There are many advantages to using a UV laser based cutting system, including:

  1. Less stress, more precision 
  2. Higher quality and flexibility 
  3. Higher yield and profits 
  4. Cleanliness 
  5. Creativity 

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It’s time to ditch those punches, routers, and saws if you want higher quality and higher yields for your more sophisticated applications.

Fill out this form for more information on our UV Laser Depaneling products.