The LPKF MicroLine family of laser depaneling systems is ideal for cutting out populated or bare circuits on any rigid, flexible, or rigid-flex substrate.
Precise UV laser beams eliminate mechanical stress and reduce thermal stress, enabling small subassemblies with higher densities to be realized. There are many advantages to using a UV laser based cutting system, including:
It’s time to ditch those punches, routers, and saws if you want higher quality and higher yields for your more sophisticated applications.
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