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LPKF ProtoLaser 200
Direct laser structuring of circuit boards.
 
Specifications
       
ProtoLaser 200
Part # 118188
Max. layout area 4” x 4” x 2” (100 x 100 x 50 mm)
Working area 9” x 12” (229 x 305 mm) a
Structuring speed Ø 6 cm2/min (1 inch2/min) (related to 18 µm / ½ Oz copper)
Beam diameter in focus 1 mil (25 µm)
Minimum track/space 2 mil/1 mil (50 µm/25 µm) c
Resolution scan field 0.08 mil (2 µm)
Repeatability ± 0.08 mil (±2 µm)
Laser pulse frequency 10-100 kHz
Machine dimensions (W/H/D) 53.5” x 75.6” x 49.2” (1,360 x 1,920 x 1,250 mm) b
Machine weight 1,433 lbs (650 kg
Operation environment specifications
Electric supply 230 V, 50-60 Hz, 1.4 kW
Compressed air supply 8 bar (116 psi), 160 l/min. (3.5 cfm)
Cooling Air-cooled, no external cooling required
Ambient temperature 68 ºF ± 4 ºF (20 ºC ±2 ºC)
Exhaust
Electric supply 230 V, 50 Hz, 1.2 kW
Weight 99.2 lbs (45 kg)
Volume flow 320 m3/h, max suction 21,000 PA
Filter Active carbon filter and new HEPA filter


“a”


“b”


“c”
  Note that the ProtoLaser 200 can address different fields on a single 9” x 12” (229 x 305 mm) workpiece.

Note that the ProtoLaser 200 requires 84.6” (2,150 mm) with the status light installed and requires 88.6” (2,250 mm) clearance to open the working door.

Note that the size of tracks and gaps depend on material and laser parameters.

*Specifications subject to change