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Winner of a 17th Annual SMT Vision Award
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The Multipurpose Tool for Micro-Material Processing
One system, many applications. The LPKF ProtoLaser U3 creates applications that were previously only possible using a large industrial system. The integrated UV laser can process a variety of materials, including laminated substrates. It is compact, easy to install, and very simple to operate – a great R & D team member at an attractive price.
- Simple job preparation
- Designed for labs: quiet and compact
- Multifunctional applications
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The Faster Route to Products
The ProtoLaser U3 shows how quickly applications can be processed. A UV laser beam can depanel individual PCBs from large circuit boards stress-free, cut LTCC and prepregs, drills holes and microvias, and structure FR4 substrates. The high pulse energy of the UV laser eliminates residue from the ablation process, resulting in geometrically precise contours. Switching between products is hassle free; the system simply requires a new project file to be loaded, offering maximum flexibility.
Broad Range of Materials
Ceramics, LTCC (green tape), FR4, microwave substrates, cover layer and metal foils, or flex and rigid-flex materials: the LPKF ProtoLaser U3 can process a variety of materials quickly, cleanly and precisely. |
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| 1. The ProtoLaser U3 achieves high detail accuracy even when creating complex geometries. |
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2. Drill hole with a diameter of 0.4 mm and a square pad. |
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3. Ultra-fine structures and clearances: line/space 50/25 μm at an angle of 135°. |
Sophisticated Laser Technology
LPKF combines expertise in laser technology and laser based material processing. Its sophisticated machines are a product of over 30 years experience in the manufacturing of prototyping and production systems.
Cutting
The ProtoLaser U3 cuts numerous materials: stress-free, with flexible contours, both populated and non-populated. The precisely focused laser beam produces very clean edges and the lasered material evaporates in a fraction of a second, leaving no residue. The laser beam can also score or cut through individual layers or thin material compounds chemical-free. It uses a non-touch process making tooling costs a thing of the past.
ProtoLaser U3 allows for precise cuts in sensitive materials such as aluminum nitride.
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| Separation of flexible printed board materials without specific holding devices using integrated vacuum table. |
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Separation of individual interconnect devices and populated circuit boards from larger panels. |
Drilling
The ProtoLaser U3 laser beam can drill holes or mircovias with a minimum diameter of only 50 μm in HDI circuit boards. The laser beam cuts through the copper layer first and then the substrate, accurately controlling the energy during the whole process. Even with 18 μm (½ oz) copper coating, a pitch of 100 μm is possible (line 70 μm / gap 30 μm) .
The LPKF ProtoLaser U3 produces excellent results when structuring 50 µm microvias or holes in RF substrates or FR4.
Structuring
The LPKF ProtoLaser U3 is ideal for structuring metallic and organic resists. The precisely calibrated laser beam produces ultra fine structures with the highest levels of accuracy. In addition, it also opens up solder resists and cover layers.
A multitalented tool: the ProtoLaser U3 structures etching resists (e. g. chemical tin) for ultra fine conductors, is perfect for further processing PCBs, and opens up solder resists without photo masks.
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| Tin-resist exposure forms the basis for ultra-fine circuit boards in the etching process. |
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Sensitive low- temperature co-fired ceramics (LTCC) are reliably structured by the UV laser beam. The ProtoLaser U3 can cut and structure these materials in a single step. |
Laminated Substrates
The LPKF ProtoLaser U3 is the only UV laser system worldwide that can also structure laminated substrates. It produces ultra-fine conductors with a line width/spacing of 70 µm / 30 µm and gently removes large metal surfaces at the same time. This system is recommended for all applications that require highly precise geometry, high repeat accuracy and layout data protection.
The LPKF ProtoLaser U3 structures laminated substrates such as FR4 or microwave substrates in just two steps. First, it produces the contours of the conductor path structure and then it removes the remaining copper surfaces using reduced power. For this process, a specialized working chamber is required which, along with a dust extraction and air knife. The LPKF CAM software is included with the system.
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| As a rule, laser structuring is a negative process: The laser removes metal layers on both sides of the desired strip conductor. The remaining portion of the metallization forms the conductive structures. |
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For structuring laminated substrates, the working chamber on the right replaces the standard one (left). The standard working chamber comes with vector lighting for better recognition of circuitry edges or fiducials. Changing the chamber is quick and easy. |
Easy Operation
All LPKF laser systems are designed for ease of use, and the ProtoLaser U3 is no exception. With little more than a click of a button, the LPKF CAM software quickly converts all standard layout data formats into production data. Process parameters are already loaded for numerous applications and the administrator mode gives full control of all the system settings.
Compact and Safe
The LPKF ProtoLaser U3 was specially developed for lab use and is classified as a Class 1 laser product in operational mode, so no protective measures are required. The LPKF ProtoLaser U3's hooded processing area prevents accidents by automatically switching the laser off as soon as the hood is opened. It is also designed with casters so that it can be easily moved form one lab to another.
Small Series and Prototypes
In addition to its flexibility, the ProtoLaser U3 offers outstanding repeatability and accuracy. The laser automatically adjusts for optimal focus and a camera uses fiducials to localize the position of the workpiece. The integrated vacuum table safely holds down flexible and thin substrates, therefore making the ProtoLaser U3 an ideal solution for small batch production on demand.
