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Winner of a 17th Annual SMT Vision Award
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The Multipurpose Tool for Micromaterial Processing
One system. Many applications. That’s laser technology. What was previously only possible using large industrial systems can now be done in the lab using an LPKF ProtoLaser U. The integrated UV laser can process almost all types of material. It is also compact, easy to install, and very simple to operate – a great R & D team member at an attractive price.
The faster route to products
The ProtoLaser U shows how fast applications can be processed. A UV laser beam for instance can stresslessly and precisely depanel separate PCBs from a large board, can cut LTCC and prepregs, drill holes and microvias, and open up solder resists. The high pulse energy of the UV laser ablates without leaving any residues – to create geometrically precise contours. Converting the system to produce different products couldn’t be easier: just load the new project file and the ProtoLaser U is ready for action – that’s maximum flexibility laser-style!
Broad Spectrum of Materials
Ceramics, LTCC (Green tape), FR4, protective films and metal foils, or flex and rigi-flex materials: the LPKF ProtoLaser U processes a whole range of materials quickly, cleanly and precisely. Tooling costs are a thing of the past. The ProtoLaser U operates using a non-touch process.
Sophisticated Laser Technology
LPKF bundles expertise in laser technology and laser based material processing. Its sophisticated machines are a product of over 30 years experience in the manufacture of prototyping and production systems.
Cutting
The ProtoLaser U cuts numerous different materials: stress-free, with flexible contours, assembled or unassembled. The precisely focused laser beam produces very clean edges – and the lasered material evaporates in a fraction of a second leaving no residues. It can score or cut through single layers or compound materials up to xxx millimeters thick.
Precision cutting of assembled or unassembled materials – even with complex shapes: ceramics, polyimide and FR4.
Drilling
The laser beam in the ProtoLaser U can drill holes or microvias with a minimum diameter of only 50 µm in HDI boards. The laser beam cuts through the copper layer first, followed by the substrate made of epoxy resin and fiberglass. The ProtoLaser U controls the energy so precisely during the process that the interior layer is only slightly roughened.
The LPKF ProtoLaser U produces excellent results when structuring 50 µm microvias or holes in HF material or FR4.
Structuring
The LPFK ProtoLaser U is ideal for structuring metallic and organic resists. The precisely regulated strength of the laser beam produces ultra fine structures with the highest levels of accuracy. It also opens up solder resists and protective films.
A multitalented tool: the ProtoLaser U structures etching resists (e. g. chemical tin) for ultra fine conductors, is perfect for further processing PCBs, and opens up solder resists without photo masks.
- Simple job preparation
- Designed for labs: quiet and compact
- Multifunctional applications
Simple Operation
This is the paradigm guiding the development of all LPKF laser systems and software interfaces. The LPKF CircuitCAM software quickly and simply converts all standard layout data formats into production data. Mostly it just takes one push of a button to operate the LPKF ProtoLaser U – process parameters are already loaded for numerous applications. Administrator mode gives full control of all the system settings.
Compact and Safe
The compact ProtoLaser U was specially developed for lab use. The hood prevents accidents: the laser switches off automatically as soon as the hood is opened. The system is classified as a Class 1 laser product in operational mode.
Mini Series and Prototypes
Beside the outstanding flexibility the ProtoLaser U is characterized by a effective production process. The laser is automatically adjusted for optimal focus, and a camera uses fiducials to localize the position of the workpiece. The integrated vacuum table safely holds down even flexible and thin substrates. Therefore the LPKF ProtoLaser U is the recommended system for prototypes an small batches – production on demand.
