Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The LPKF Contac S4 enables robust electro plating in one compact safety housing.
The board is passed through separate tanks for cleaning, activation and copper plating. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards.
The Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). It offers an optional subsequent tin plating step for premium surface finish and improved solderability.
Optimized anode plates and periodic reverse pulse plating ensures homogeneous deposition of the plated copper, and carbon activation using black hole technology, integrated air blow-in, and an additional process step for via cleaning ensure reliable connections to the copper surface without the problem of layer detachment. The result is a homogeneous layer thickness in the holes and on the flat metal surface of the substrate.
The integrated touch panel safely guides even inexperienced users through the electro plating process. The operation requires no knowledge of chemistry as the system automatically indicates the necessary maintenance steps.
Technical Specifications: LPKF Contac S4
|Max. material size (X x Y)||230 mm x 330 mm (9” x 13”)|
|Max. layout area (X x Y)||200 mm x 300 mm (7.8” x 11.8”)|
|Reversing pulse plating||Adjustable|
|Tolerance||± 2 µm (plated copper)|
|Minimum hole diameter||≥ 0,2 mm|
|ViaCleaner Bath||Included (requires consumables)|
|Chemical tinning Bath||Included (requires consumables)|
|Process time||Approx. 90 - 120 min||Electrical consumption||115 / 230 V, 50 - 60 Hz, 0,6 kW|
|Dimensions (W x H x D)||856 mm x 446 mm x 542 mm (33.7” x 17.5” x 21.3”)|
|Weight||~ 80 kg unfilled, ~ 115 kg filled|
|Base material types|| Ideal for FR4, G10, thermoset microwave substrates such as RO4000 (e.g. RO4003C™, RO4350B™)
and TMM as well PTFE substrates with ceramic filler (e.g. RO3000, etc.).