The LPKF ProtoFlow S4 is a convection oven for lead-free reflow soldering. It is a key component in rapid SMD prototyping and small batch production. Compact and versatile, the ProtoFlow S4 offers a large working and microprocessor-controlled temperature/time profiles. The LPKF ProtoFlow S4 is excellent for SMD Reflow soldering, adhesive hardening by precipitation, hardening by precipitation of conductive paste for plated-through holes, and other thermal procedures. Active cooling at the end of the soldering process with the chamber closed prevents uncontrolled temperature fluctuations in the material..
Visually monitoring of the process is made possible by the large inspection window in the door. Integrated interior lighting reveals the status of the soldering process and allows for on-the-fly job modification where needed to optimize the reflow process.
Technical Specifications: ProtoFlow S4
|Max. PCB size||320 mm x 220 mm (12.6” x 8.6”)|
|Max. reflow temperature||290 °C (554 °F)|
|Outlet tube for active cooling||Outlet tube for active cooling|
|Time for temperature stabilization||220 °C, 64 h|
|Temperature Stabilization time||<5 min|
|Ambient temperature||0 – 40 °C (32 – 104 °F)|
|Power Supply||230 V, 50/60 Hz, single-phase 3.5 kW|
|Dimensions (W x D x H)||555 mm x 480 mm x 300 mm (21.7” x 18.9” x 11.8”)|
|Weight||38 kg (83.8 lbs)|
|Required software||Windows 10|