The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, easy programming, and many pre-defined temperature profiles. The compact design and efficient power consumption make it one of the most useful components in any rapid PCB prototyping environment.
The LPKF ProtoFlow S is a convection oven for lead-free reflow soldering. It is a key component in rapid SMD prototyping and small batch production. Compact and versatile, the ProtoFlow S offers a large working area with motorized drawer for automatic cool-down and easy access, and microprocessor controlled temperature/time profiles. The LPKF ProtoFlow S is excellent for SMD Reflow soldering, adhesive hardening by precipitation, hardening by precipitation of conductive paste for plated-through holes, and other thermal procedures.
The LPKF ProtoFlow S can be fitted with a flow meter for inert gas to prevent oxidation during the reflow process, assuring optimal results of soldered joints.
The LCD display allows for extremely easy data setting. All profile parameters such as temperature, process duration, and cooling airflow can be individually programmed and stored as custom profiles, both in the ProtoFlow memory and via USB cable onto a host PC, allowing for virtually unlimited flexibility and profile storage.
The LPKF ProtoFlow S can be fitted with four optional thermocouple probes, which can be mounted anywhere on the PCB or components, allowing for complete data logging of temperature changes and instant feedback to the user. This data can be stored on a PC and analyzed later.
The LPKF ProtoFlow S is equipped with a motorized drawer which allows easy access to the circuit board. The drawer can be programmed to open automatically, starting the cool-down phase. An operator is not required to constantly attend the process.
Observe the process through the ProtoFlow S's window. Integrated interior lighting reveals the status of the soldering process and allows for on-the-fly job modification where needed to optimize the reflow process.
External connection with flow meter for inert gas is available for the LPKF ProtoFlow S. Nitrogen atmosphere reduces the chances of oxidation during the process and ensures superior soldered joints.
Technical Specifications: ProtoFlow S
|PCB size (max.)||230 mm x 305 mm (9" x 12")|
|Max. Preheating temperature, time||220 °C, 999 s|
|Max. reflow temperature, time||320 °C, 600 s|
|Max. long thermal treatment temp., time||220 °C, 64 h|
|Temperature Stabilization time||<5 min|
|PCB Cooling||Double, speed adjustable bottom-mounted fan|
|Power Supply||Single Phase 220-240 V, 50-60 Hz, 3500 W (max.)|
|Dimensions (WxHxD)||647 mm x 315 mm x 450 mm (22.5" x 12.5" x 17.7")|
|Weight||22 kg (48.5 lbs)|