The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations.
The LPKF ProtoLaser U4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. The control PC is integrated into the ProtoLaser U4.
Delicate, sensitive processes do not require a lot of laser energy, but rather especially little. Multiple processing produces highly precise structures on sensitive substrates. The new UV laser source is now stabilized across a large performance range. It can now safely process additional material groups and thin layers.
A new performance measuring field determines the actual laser performance in the focal position and displays it. Here, LPKF has met demands from customers who want exact actual data for documentation.
The LPKF ProtoLaser U4 uses a newly designed vision system optimized for laser micro material processing. The camera and image recognition process probe any fiducials or geometric structures on the substrate to be processed. A higher resolution and faster detection algorithms accelerate the manufacturing process.
The laser process itself stands out from competing processes due to its high flexibility and fast processing. The laser uses no environmentally hazardous chemicals, requires no masks and keeps outlay for tool production to a minimum. The laser works contact-free and therefore can also be used with sensitive materials.
The ProtoLaser U4 can make prototypes of a quality that meets or even exceeds that of industrial processing. It is also suitable for small series production and for production of individual components with high variance.
Technical Specifications: ProtoLaser U4
|Max. material size and layout area (X x Y x Z)||229 mm x 305 mm x 10 mm
(9” x 12” x 0.4”)
|Laser wavelength||355 nm|
|Laser pulse frequency||25 kHz – 300 kHz|
|Structuring speed||200 mm/s (7.8”/s) on 18 μm (½ oz) Cu on FR4|
|Cutting speed||200 mm/s (7.8”/s) 0.5 mm (0.02”) FR4*|
|Laser spot diameter in focus position||20 μm|
|Minimum line / space||50 μm / 20 μm (1.96 mil / 0.8 mil) on 18 μm (½ oz) Cu on FR4|
|Accuracy**||± 1.98 μm (± 0.08 mil)|
|Dimensions (W x H x D)||910 mm x 1 650 mm x 795 mm (35.8” x 65” x 31.3”);
height with open door 1 765 mm (69.5”)
|Electrical consumption||110 V – 230 V; 1.4 kW|
|Required compressed air supply||Min. 6 bar (87 psi), min. 230 l/min (8.12 cfm)|
|Required accessories||Exhaust unit, compressor, PC|