ProtoLaser S4

ProtoLaser S4

Laser Structuring of Prototype PCBs and Small Series

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New Design

The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional.

Cost-Effectiveness Built In

The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks.

Expanded Process Window

Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers with up to 6 μm variance in Cu thickness - e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut rigid or flexible substrates efficiently with thicknesses of up to 0.8 mm.

Vision System

The LPKF ProtoLaser S4 has a newly designed fiducial recognition camera and image processing system that has been optimized for circuit board prototyping. A higher resolution and faster detection algorithms accelerate the manufacturing process. This camera allows the LPKF ProtoLaser S4 to visually inspect and properly align the workpiece.

The LPKF ProtoLaser S4 laser system can laser etch PCBs in minutes on a wide range of laminated substrates, FR4 and PTFE or woven PCB materials. Prototypes and small production batches can also be produced on short notice if required. The system requires no chemicals and is easy to operate with LPKF CircuitPro software included.

The LPKF ProtoLaser S4 is even more precise than the mechanical systems and is therefore ideal for HF and microwave circuits, as well as digital and analog circuits. It produces precise geometries on a whole range of substrates such as copper-clad FR4, aluminum-coated PET films, ceramics, Duroid and PTFE.

Alignment for two-sided prototypes increases tremendously with the fiducial recognition camera. This camera allows the LPKF ProtoLaser S4 to visually inspect and properly align the workpiece.

For drilling through-holes in thicker printed circuit boards and for multilayer applications, an LPKF ProtoMat is a perfect complement to a LPKF ProtoLaser S4.

  • Specialist in circuit board processing
  • Laser wavelength of 532 nm (green)
  • Process reliability
  • Up-to-date design
  • CircuitPro system software

Technical Specifications: ProtoLaser S4

Max. material size and layout area
(X x Y x Z)
229 mm x 305 mm x 10 mm
(9” x 12” x 0.4” )
Laser wavelength 532 nm
Laser pulse frequency 25 kHz – 300 kHz
Structuring speed 650 mm/s (25”/s) on 18 μm / ½ oz Cu on FR4
Laser spot diameter in focus position 23 μm (0.9 mil)
Minimum line / space 75 µm/25 µm (2.9 mil/1 mil), on laminated substrate (18 µm Cu)
Accuracy* ± 1.98 μm (± 0.08 mil)
Dimensions (W x H x D) 910 mm x 1 650 mm x 795 mm (35.8” x 65” x 31.3”);
height with open door 1 765 mm (69.5”)
Weight 340 kg
Electrical consumption 110 V – 230 V; 1.4 kW
Required compressed air supply Min. 6 bar (87 psi), min. 230 l/min (8.12 cfm)
Required accessories Exhaust unit, compressor, PC
* Resolution scanfield
Technical specifications subject to change.
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