With the compact LPKF ProtoLaser H4, laser-etched PCBs with nearly exact geometries can be created in just a few minutes. The PCB prototypes are manufactured in an extremely material-friendly process. This is made possible through a combination of the high precision of the machine’s NIR fiber laser source and the high cutting speed achieved with integrated mechanical drilling and routing. With its compact tabletop format, the LPKF ProtoLaser H4 can be used in any laboratory for processing materials from FR4 to sensitive RF substrates.
The LPKF ProtoLaser H4 enables efficient prototyping of complex digital, analog, RF and microwave circuit boards. The laser system achieves exact geometries on almost any material and is ideal for creating single or double-sided circuit boards, antennas, filters and many applications where precise, steep sidewalls are required.
The LPKF ProtoLaser H4 is also suitable for the production of multilayer boards with the additional of the LPKF MultiPress S4 lamination press, Contac S4 copper plating or ProConduct silver through-hole plating option. An included vacuum table also secures the PCB material during laser and mechanical processing.
LPKF CircuitPro software is included with this turn-key system for data preparation and system control in one single platform. An integrated fiducial alignment camera allows high precision positioning for front to back alignment and loading of pre-drilled and cut-out PCBs.
The ProtoLaser H4 table-top laser system adds capabilities from the previous generation and requires only a power socket and clean/dry compressed air. In operation, the LPKF ProtoLaser H4, which has a granite base, corresponds to a laser class 1 safety rating; no further protective measures are required.
Technical Specifications: ProtoLaser H4
|Max. material size and layout area (X/Y/Z)||305 mm x 229 mm x 7 mm (12” x 9” x 0.28”)|
|Laser wavelength, frequency, max. laser power||1064 nm, 25–400 kHz,16 W|
|Diameter of focused laser beam||27 ± 2 µm (0.78 ± 0.08 mil)|
|Structuring speed||8.5 cm2/min (1.3 in2/min) on laminated substrates 18 µm (0.5 oz) Cu|
|Minimum line/space||100 µm/50 µm (3.9 mil/2 mil)a on FR4 18 µm (0.5 oz) Cu|
|Scanner resolution, repeatability in the scan field||1 µm (0.04 mil), ±1.8 µm (± 0.07 mil)|
|Positioning accuracy in the scan field||±10 µm (±0.39 mil)|
|Milling spindle max speed, tool positions||60,000 RPM variable speed, 6 position auto tool change|
|Tool sensor accuracy||± 5 µm|
|Laser pulse frequency||25-400 kHz|
|Dimensions (W x H x D), Weight||725 mm x 665 mm x 840 mm (28.6” x 26.2” x 33.1”), 125 kg (275 lbs)|
|Power supply||115–230 V, 50–60 Hz, 500 W|
|Compressed air supply required||Min. 5 bar; 50 l/min (min. 73 PSI; 50 l/min) Cleand/Dry|
|Ambient temperature; humidity||22 °C ± 2 °C (71.6 °F ± 4 °F); < 60%|
|Software||LPKF CircuitPro RP|
|Laser safety||Laser Class 1|
|Options and accessories||LPKF CircuitPro RP Advanced, dust extraction unit, compressor, starter set|