Most often circuit board manufacturers use 'size standardized' panels in their production processes. This standardization simplifies their processes and sometimes also can benefit the assembly process when multiple boards can be processed as one item.
When producing large boards possibly only one may fit in the panel, for small boards many can fit. But in either case at some point in the overall process individual boards have to be removed from the panel. Multiple solutions exist, like punching, V-scoring, wheel cutting, routing and lately also laser depaneling. We will be reviewing some of the impacts these methods on the final product and determine how the newer method of laser depaneling can be.