The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.
LPKF MicroLine 2000 process advantages Compared to conventional tools, laser processing offers a compelling series of advantages.
UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required. In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.
The UV laser cuts substrates in the immediate vicinity of sensitive components or strip conductors - without mechanical stress. Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB - and at the same time the process reduces the reject rate
Technical Specifications: MicroLine 2000 P/S
|Max. Working Area (X.Y.Z)||350 mm x 350 mm x 11 mm (13.8" x 13.8" x 0.4")|
|Max. Recognition area (X.Y)||300 mm x 300 mm (11.8" x 11.8")|
|Max. Material Size||350 mm x 350 mm (13.8" x 13.8")|
|Data Input Formats||Gerber, X=Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB++|
|Max. Structuring Speed||Dependant on application|
|Positioning Accuracy||+/- 25 µm (1 mil)|
|Diameter of Focused Beam||20 µm (0.8 mil)|
|Laser Wavelength||355 nm|
|System Dimensions (WxHxD)||875 mm x 1530 mm x 1300 mm (34.5" x 60.2" x 51.2")*|
|Weight||450 kg (990 lbs)|
|Power Supply||230 VAC, 50-60Hz, 1.5 kW (3 kW in 2820 P Model)|
|Cooling||Air-cooled (internal cooling cycle)|
|Ambient Temperature||22 °C +/- 2 °C (68 °F +/- 2 °F)|
|Required Accessories||Exhaust unit (And production fixture in S model)|