MicroLine 2000 P/S

MicroLine 2000 P/S

Precision Cutting for Printed Circuit Boards and Cover Layers

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The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

LPKF MicroLine 2000 process advantages Compared to conventional tools, laser processing offers a compelling series of advantages.

  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

MicroLine 2000 P - Processing Flat Substrates

UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required. In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.

  • Complex contours
  • No substrate brackets or cutting tools
  • More panels on the base material
  • Perforations and decaps

MicroLine 2000 S - Cutting Assembled Circuit Boards

The UV laser cuts substrates in the immediate vicinity of sensitive components or strip conductors - without mechanical stress. Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB - and at the same time the process reduces the reject rate

  • Circuit board thickness up to 1.6 mm
  • Close to strip conductors or components
  • Optimal utilization of the substrate

Technical Specifications: MicroLine 2000 P/S

Laser Class 1
Max. Working Area (X.Y.Z) 350 mm x 350 mm x 11 mm (13.8" x 13.8" x 0.4")
Max. Recognition area (X.Y) 300 mm x 300 mm (11.8" x 11.8")
Max. Material Size 350 mm x 350 mm (13.8" x 13.8")
Data Input Formats Gerber, X=Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB++
Max. Structuring Speed Dependant on application
Positioning Accuracy +/- 25 µm (1 mil)
Diameter of Focused Beam 20 µm (0.8 mil)
Laser Wavelength 355 nm
System Dimensions (WxHxD) 875 mm x 1530 mm x 1300 mm (34.5" x 60.2" x 51.2")*
Weight 450 kg (990 lbs)
Operating Conditions  
Power Supply 230 VAC, 50-60Hz, 1.5 kW (3 kW in 2820 P Model)
Cooling Air-cooled (internal cooling cycle)
Ambient Temperature 22 °C +/- 2 °C (68 °F +/- 2 °F)
Humidity <60% (non-condensing)
Required Accessories Exhaust unit (And production fixture in S model)
*    Height incl. StatusLight = 2020 mm (79.6”)
Technical specifications subject to change.
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