MicroLine 2000 P

Laser Processing of Bare PCBs

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Populated boards are easily processed with custom fixtures on the MicroLine 2000 S and Ci systems. Simple and inexpensive production fixtures can be made to depanel boards that have components on both sides of the substrate.

The MicroLine 2000 S and Ci systems provide clean cuts in FR4, FR5, and CEM materials. Further materials include polyesters, ceramics and other RF-materials.

The MicroLine 2000 Ci features integrated feed conveyors and SMEMA-compatible interfaces. The system's architecture allows for transportation of the applications through the machine. Click here for more info

The MicroLine 2000 P is a UV laser systems designed for processing bare rigid and flexible PCBs. The UV laser cuts, drills, engraves and ablates with the tightest tolerances on a wide variety of materials making it the most versatile and inexpensive UV laser on the world-wide market today. It has the ability to cleanly cut even the most complicated patterns with minimal stress to the substrate which allows for more circuits on a single panel and eliminates the limitations of tooling with the use of an integrated vacuum table. With the highest cutting quality and versatile processing capabilities, it greatly reduces operational costs incurred from outsourcing. The MicroLine P models are especially suited for high-mix, flexible manufacturing environments.

Environmentally friendly, the triple stage dust and fume exhaust unit removes all debris, leaving a residue-free surface and avoiding pollution in the work environment. It not only cuts PCBs, but is also capable of drilling, skiving, engraving/marking, depth/pocket etching, and even surface ablation for creating circuitry directly on bare boards. With just the change of CAD data for new projects or processes, the UV laser system is ready to produce another design within a few moments, providing users increased freedom in process planning from prototyping to mass production. The beam cuts very narrow channels and copes with even the tightest radii. Laser power measurement takes place at the laser source, ensuring proper process monitoring for quality control. This ability to create custom "virtual" laser tools in the tool library allows users to save exact process parameters for an unlimited amount of material variations and combinations.