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You are here: News > Fan-Out Wafer-Level Packaging Using Glass Substrates for Heterogeneous Integration – Laser-Induced Deep Etching Opens New Perspectives

Fan-Out Wafer-Level Packaging Using Glass Substrates for Heterogeneous Integration – Laser-Induced Deep Etching Opens New Perspectives.

"With the new LIDE precision process, we are enabling micro-systems technology to exploit the full potential of glass," explained Dr. Roman Ostholt, Vice President of LIDE at LPKF, in a presentation at the 3D Systems Summit 2019 in Dresden, Germany. The LIDE process examples ranged from through glass vias to glass embedding and glass capping solutions with vertical walls.

Due to its properties, glass is one of the most interesting materials for advanced IC and wafer level packaging applications. For a long time, glass was very difficult to process. Production-related surface defects have given glass the reputation of being brittle and susceptible to fracture, and therefor glass was, at best, suitable for simple packaging tasks. "Thanks to laser induced deep etching technology (LIDE), it’s finally possible to create deep microstructures in glass without causing micro-cracks, stress or other surface defects; The process is extremely precise and fast. With the use of LIDE-processed glass, even more is possible in heterogeneous integration of advanced IC and wafer level packaging than ever before".

The information from the lecture on the LIDE process and the possibilities it opens up for micro-systems technology can be found on the Vitrion web page: www.vitrion.com.