3D molded interconnect devices (MIDs) utilize the best of both mechanical and electrical design - saving space, reducing cost, and increasing reliability. With the ever-present trend towards miniaturization and the need for versatile production options, laser direct structuring (LDS) has been at the forefront of the MID resurgence.
Laser direct structuring is a 3-step process for creating MIDs that makes entering their world a viable option for companies in all industries - from automotive to medical to telecommunications. Register for this original webinar to learn why creating 3D circuitry on thermoplastics may be right for you.
In The Webinar:
Why designers should consider 3D circuitry on thermoplastics
Benefits and history of the molded interconnect device
What laser direct structuring is and how it works
MID applications created with LDS
Who This Will Benefit:
Electrical designers and engineers
Mechanical designers and engineers
Wiring harness designers
Chief technology officers
Manufacturing and production engineers
Designers in any of the following industries: automotive, medical, telecommunications, security, RFID, micropackaging