Molded Interconnect
Devices Home
Laser Direct
Structuring Equipment
LDS Process
Articles &
Technical Papers
LDS Grade Materials
MID Service Suppliers
Design Rules
MID Newsletters
3D Circuitry on Thermoplastics
Laser Solutions for Automotive Design and Manufacturing
3D Antennas on Plastic
LPKF MicroLine 3D IR Industrial Download the LDS Brochure
See a video about 3D MID structuring
See a video about
3D MID structuring

3D Circuitry on Thermoplastics

3D molded interconnect devices (MIDs) utilize the best of both mechanical and electrical design - saving space, reducing cost, and increasing reliability. With the ever-present trend towards miniaturization and the need for versatile production options, laser direct structuring (LDS) has been at the forefront of the MID resurgence.

Laser direct structuring is a 3-step process for creating MIDs that makes entering their world a viable option for companies in all industries - from automotive to medical to telecommunications. Register for this original webinar to learn why creating 3D circuitry on thermoplastics may be right for you.

In The Webinar:
  • Why designers should consider 3D circuitry on thermoplastics
  • Benefits and history of the molded interconnect device
  • What laser direct structuring is and how it works
  • MID applications created with LDS

Who This Will Benefit:
  • Electrical designers and engineers
  • Mechanical designers and engineers
  • Antenna designers
  • Wiring harness designers
  • Chief technology officers
  • Manufacturing and production engineers
  • Designers in any of the following industries: automotive, medical, telecommunications, security, RFID, micropackaging

Additional materials: