The LPKF MicroLine 3D was specially developed for the laser structuring of molded interconnect devices
(MID). The laser writes the circuit-layout onto the plastic components. Then these structures get metallized – and become conductive. The tool-less machining with the LPKF MicroLine 3D is ideal for a diverse product mix. It boasts the flexibility to accommodate customer demands and satisfy production planning because different designs can be very quickly set up and produced efficiently. The LPKF MicroLine 3D is set up for manual loading and unloading routines as well as a production machine for automatic handling.
Sophisticated laser technology
LPKF Laser & Electronics AG bundles core competencies in laser technology and laser-based material processing. The sophistication of its machines is built on over 30 years experience in manufacturing prototyping and production systems for industrial applications. The manufacturers of innovative PCBs profit every day from the high quality of its products and services. |
