Laser Direct Structuring Equipment
The desired interconnect pattern is directly written on the molded part utilizing a LPKF’s scanner based MicroLine 3D IR laser system, and the conductive paths are plated using industry standard electroless plating technology. The plating adheres only where the plastic has been activated by the laser.
The MicroLine 3D IR Industrial is a specially developed laser system for the volume production of 3D molded interconnect devices (MIDs). The systems uses a Nd:VO 4 laser with a high-speed scanner to write the interconnect pattern directly onto an injection molded component directly from the CAD data
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