Molded Interconnect Devices (MID)

The new LPKF laser direct structuring (LDS) process greatly simplifies this task, and also allows a significantly greater degree of precision. The structure is molded in a standard mold using one of several proprietary plastics available, then the desired interconnect pattern is directly written on the resulting molded part and the conductive paths are plated using industry-standard methods. The plating adheres only where the plastic has been activated by the laser.

The new LPKF laser direct structuring (LDS) process greatly simplifies this task, and also allows a significantly greater degree of precision. The structure is molded in a standard mold using one of several proprietary plastics available, then the desired interconnect pattern is directly written on the resulting molded part and the conductive paths are plated using industry-standard methods. The plating adheres only where the plastic has been activated by the laser.

Materials

There is a variety of plastic materials in LDS grade available. Please check our materials section for details.