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Articles


   
  3D MID Sensor Fabricated with Ticona Laser-activated LCP Circuits
http://www.plasticstoday.com/articles/molex-transfers-lds-knowhow-and-capacity-medical-devices1107201102
January 25, 2012
   
  Molex transfers 3D electronics to medical devices
http://www.plasticstoday.com/articles/molex-transfers-lds-knowhow-and-capacity-medical-devices1107201102
by Doug Smock
November 7th, 2011
   
Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect Devices Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect Devices
http://opus.kobv.de/tuberlin/volltexte/2010/2598/pdf/dressler_marc.pdf
by Marc Dressler
March 29, 2010
   
  Molex Ships 100 Millionth Antenna with Laser Direct Structuring (LDS) Technology
http://www.businesswire.com/news/dentonrc/20101021005750/en/Molex-Ships-100-Millionth-Antenna-Laser-Direct
by Molex Incorporated
October 26th, 2010
   
3D Components Cut Product Costs 3D Components Cut Product Costs
http://www.lpkfusa.com/articles/mid/3D_Componenets_Cut_Product_Cost.pdf
by Wolfgang John
October 2010
   
  Molex Produces 20 Millionth Antenna with LDS Technology
http://www.molex.com/cmc_upload/0/000/448/950/20-millionth_antenna.html
by Molex Incorporated
July 15th, 2009
   
MIDs Make a Comeback CONNECTORS & CORDS: Laser Lays it On
http://www.appliancedesign.com/CDA/Archives/e5b9fe610fd19010VgnVCM100000f932a8c0
by Mary Lowe
Appliance Design Magazine, February 1, 2006
 
MIDs Make a Comeback MIDs Make a Comeback
http://www.plasticstechnology.com/articles/200506fa1.html
by Joseph A. Grande
Plastics Technology, June, 2005
   
Simple Molded Circuits Simple Molded Circuits
http://www.designnews.com/article/CA486937.html
by Joseph Ogando
Design News, December, 2004
   
Circuitry leaps from 2D boards to 3D forms Circuitry leaps from 2D boards to 3D forms
http://lfw.pennnet.com/Articles/Article_Display.cfm?
Section=ARTCL&ARTICLE_ID=197344&VERSION_NUM=1

by Hassaun A. Jones-Bey
Laser Focus World, January, 2004
   
  Solid State Power Controller in MID-Technique
http://www.lpkfusa.com/articles/mid/micropackaging.pdf
by Eberhard Leipe, Bernd Rösener
PLUS Magazine 2003

Case Studies

Siemens Acuris P Hearing Aid using MID
http://www.lpkfusa.com/articles/mid/mid_conference_09-2004.pdf

Technical Papers

Manufacturing of Molded Interconnect Devices from Prototyping to Mass Production with Laser Direct Structuring
http://www.lpkfusa.com/articles/mid/mid_conference_09-2004.pdf
by Nils Heininger, Dr. Wolfgang John I & T and Hans-Jürgen Boßler
Presented at the MID Congress 2004, Erlangen, Germany
 
Laser-based production of multifunction packages taking innovative rotary encoders for automation and vehicle technology as examples
http://www.lpkfusa.com/articles/mid/rotary_encoders.pdf
by Nils Heininger, Dirk Ahrendt, Wolfgang Eberhardt, Heinz Kück, Lars Blassmann, Christoph Hanisch and Stephan Schauz
Presented at MID Meeting 2004 Japan