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Articles

MIDs Make a Comeback CONNECTORS & CORDS: Laser Lays it On
http://www.appliancedesign.com/CDA/Archives/e5b9fe610fd19010VgnVCM100000f932a8c0
by Mary Lowe
Appliance Design Magazine, February 1, 2006
 
MIDs Make a Comeback MIDs Make a Comeback
http://www.plasticstechnology.com/articles/200506fa1.html
by Joseph A. Grande
Plastics Technology, June, 2005
   
Simple Molded Circuits Simple Molded Circuits
http://www.designnews.com/article/CA486937.html
 by Joseph Ogando
Design News, December, 2004
   
Circuitry leaps from 2D boards to 3D forms Circuitry leaps from 2D boards to 3D forms
http://lfw.pennnet.com/Articles/Article_Display.cfm?
Section=ARTCL&ARTICLE_ID=197344&VERSION_NUM=1
by Hassaun A. Jones-Bey
Laser Focus World, January, 2004
   
  Solid State Power Controller in MID-Technique
http://www.lpkfusa.com/articles/mid/micropackaging.pdf
by Eberhard Leipe, Bernd Rösener
PLUS Magazine 2003

Case Studies
Siemens Acuris P Hearing Aid using MID
http://www.lpkfusa.com/articles/mid/mid_conference_09-2004.pdf

Technical Papers
Manufacturing of Molded Interconnect Devices from Prototyping to Mass Production with Laser Direct Structuring
http://www.lpkfusa.com/articles/mid/mid_conference_09-2004.pdf
by Nils Heininger, Dr. Wolfgang John I & T and Hans-Jürgen Boßler
Presented at the MID Congress 2004, Erlangen, Germany
 
Laser-based production of multifunction packages taking innovative rotary encoders for automation and vehicle technology as examples
http://www.lpkfusa.com/articles/mid/rotary_encoders.pdf
by Nils Heininger, Dirk Ahrendt, Wolfgang Eberhardt, Heinz Kück, Lars Blassmann, Christoph Hanisch and Stephan Schauz
Presented at MID Meeting 2004 Japan