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Articles


3D LDS Components PCB Magazine September 2014 3D LDS Components: New Opportunities in PCB Layout and Production
http://www.lpkfusa.com/articles/mid/3D_LDS_Components-PCB_Mag_09-2014.pdf
by Malte Borges
September 2014
What are molded interconnect devices? What are molded interconnect devices?
http://www.lpkfusa.com/articles/mid/What-are-molded-interconnect-devices.pdf
January 2014
What are molded interconnect devices? LPKF Researchers Develop Powder Coating for Molded Interconnect Devices
http://www.lpkfusa.com/articles/mid/LDS-powder-coating-MID.pdf
May 2013
Using Laser Direct Structuring (LDS) to Create Robust Hardware Security Devices Using Laser Direct Structuring (LDS) to Create Robust Hardware Security Devices
http://www.lpkfusa.com/articles/mid/Defense_Tech_Briefs_October.pdf
by Jim Liddle
October 2012
Using Laser Direct Structuring (LDS) to Create Robust Hardware Security Devices 3D LDS Components for New Production Opportunities
http://www.microwavejournal.com/articles/16917-3d-lds-components-for-new-production-opportunities
February 14, 2012
3D MID Sensor Fabricated with Ticona Laser-activated LCP Circuits 3D MID Sensor Fabricated with Ticona Laser-activated LCP Circuits
http://www.plasticstoday.com/articles/molex-transfers-lds-knowhow-and-capacity-medical-devices1107201102
January 25, 2012
Molex transfers 3D electronics to medical devices Molex transfers 3D electronics to medical devices
http://www.plasticstoday.com/articles/molex-transfers-lds-knowhow-and-capacity-medical-devices1107201102
November 7th, 2011
Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect Devices Reliability Study of Stud Bump Bonding Flip Chip Assemblies
on Molded Interconnect Devices
http://opus.kobv.de/tuberlin/volltexte/2010/2598/pdf/dressler_marc.pdf
by Marc Dressler
March 29, 2010
Using Laser Direct Structuring (LDS) to Create Robust Hardware Security Devices Molex Ships 100 Millionth Antenna with Laser Direct Structuring (LDS) Technology
http://www.businesswire.com/news/dentonrc/20101021005750/en/Molex-Ships-100-Millionth-Antenna-Laser-Direct
October 26th, 2010
3D Components Cut Product Costs 3D LDS Components for New Production Opportunities
http://www.lpkfusa.com/articles/mid/3D_Componenets_Cut_Product_Cost.pdf
by Wolfgang John
October 2010
Molex Produces 20 Millionth Antenna with LDS Technology Molex Produces 20 Millionth Antenna with LDS Technology
http://www.molex.com/cmc_upload/0/000/448/950/20-millionth_antenna.html
by Molex Incorporated
July 15th, 2009
CONNECTORS & CORDS: Laser Lays it On CONNECTORS & CORDS: Laser Lays it On
http://www.lpkfusa.com/pressreleases/Connectors_and_cords.pdf
by Mary Lowe
Appliance Design Magazine, February 1, 2006


Case Studies


Siemens Acuris P Hearing Aid using MID Siemens Acuris P Hearing Aid using MID
http://www.lpkfusa.com/articles/mid/siemens_hearing_aids.pdf


Technical Papers


Manufacturing of Molded Interconnect Devices Manufacturing of Molded Interconnect Devices from Prototyping
to Mass Production with Laser Direct Structuring
http://www.lpkfusa.com/articles/mid/mid_conference_09-2004.pdf
by Nils Heininger, Dr. Wolfgang John I & T and Hans-Jürgen Boßler
Presented at the MID Congress 2004, Erlangen, Germany
Siemens Acuris P Hearing Aid using MID Laser-based production of multifunction packages taking innovative
rotary encoders for automation and vehicle technology as examples
http://www.lpkfusa.com/articles/mid/rotary_encoders.pdf
by Nils Heininger, Dirk Ahrendt, Wolfgang Eberhardt, Heinz Kück,
Lars Blassmann, Christoph Hanisch and Stephan Schauz
Presented at MID Meeting 2004 Japan