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Articles
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3D MID Sensor Fabricated with Ticona Laser-activated LCP Circuits
http://www.plasticstoday.com/articles/molex-transfers-lds-knowhow-and-capacity-medical-devices1107201102
January 25, 2012 |
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Molex transfers 3D electronics to medical devices
http://www.plasticstoday.com/articles/molex-transfers-lds-knowhow-and-capacity-medical-devices1107201102
by Doug Smock
November 7th, 2011 |
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Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect Devices
http://opus.kobv.de/tuberlin/volltexte/2010/2598/pdf/dressler_marc.pdf
by Marc Dressler
March 29, 2010 |
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Molex Ships 100 Millionth Antenna with Laser Direct Structuring (LDS) Technology
http://www.businesswire.com/news/dentonrc/20101021005750/en/Molex-Ships-100-Millionth-Antenna-Laser-Direct
by Molex Incorporated
October 26th, 2010 |
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3D Components Cut Product Costs
http://www.lpkfusa.com/articles/mid/3D_Componenets_Cut_Product_Cost.pdf
by Wolfgang John
October 2010 |
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Molex Produces 20 Millionth Antenna with LDS Technology
http://www.molex.com/cmc_upload/0/000/448/950/20-millionth_antenna.html
by Molex Incorporated
July 15th, 2009 |
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CONNECTORS & CORDS: Laser Lays it On
http://www.appliancedesign.com/CDA/Archives/e5b9fe610fd19010VgnVCM100000f932a8c0
by Mary Lowe
Appliance Design Magazine, February 1, 2006 |
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MIDs Make a Comeback
http://www.plasticstechnology.com/articles/200506fa1.html
by Joseph A. Grande
Plastics Technology, June, 2005 |
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Simple Molded Circuits
http://www.designnews.com/article/CA486937.html
by Joseph Ogando
Design News, December, 2004 |
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Circuitry leaps from 2D boards to 3D forms
http://lfw.pennnet.com/Articles/Article_Display.cfm?
Section=ARTCL&ARTICLE_ID=197344&VERSION_NUM=1
by Hassaun A. Jones-Bey
Laser Focus World, January, 2004 |
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Solid State Power Controller in MID-Technique
http://www.lpkfusa.com/articles/mid/micropackaging.pdf
by Eberhard Leipe, Bernd Rösener
PLUS Magazine 2003 |
Case Studies
Technical Papers
Manufacturing of Molded Interconnect Devices from Prototyping to Mass Production with Laser Direct Structuring
http://www.lpkfusa.com/articles/mid/mid_conference_09-2004.pdf
by Nils Heininger, Dr. Wolfgang John I & T and Hans-Jürgen Boßler
Presented at the MID Congress 2004, Erlangen, Germany |
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Laser-based production of multifunction packages taking innovative rotary encoders for automation and vehicle technology as examples
http://www.lpkfusa.com/articles/mid/rotary_encoders.pdf
by Nils Heininger, Dirk Ahrendt, Wolfgang Eberhardt, Heinz Kück, Lars Blassmann, Christoph Hanisch and Stephan Schauz
Presented at MID Meeting 2004 Japan |
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