North America

PCB Depaneling With Lasers Webinar

Depaneling of modern circuit boards can be a difficult task. Smaller, more complex PCBs are creating a demand for more sophisticated depaneling solutions.

This webinar will walk you through the advantages and disadvantages of laser depaneling in comparison to more traditional methods of depaneling such as routing, die cutting and dicing saws. By the end of the webinar you will have a better understanding of laser depaneling and if it is a viable solution for your needs.

In The Webinar:

  • A full comparison of depaneling methods
  • Miniaturization: why smaller boards demand less stress and more precision
  • Cost reduction: an unveiling of the costs involved in all methods
  • Versatility: is your depaneling technology giving you an edge or holding you back?

Who This Will Benefit:

  • PCB Engineers/Designers
  • Manufacturing and Production Engineers
  • Production Managers

Additional materials: