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PCB Laser Technology for Rigid and Flex HDI – Via Formation, Structuring, Routing
by Dr. Dieter J. Meier LPKF Laser & Electronics AG Garbsen and
Stephan H. Schmidt LPKF Laser & Electronics Wilsonville, OR
Published at IPC Printed Circuit Expo 2002, Long Beach, CA |
Microvia Formation using UV Laser
by Bernd Lange, LPKF Laser & Electronics AG |
Highly Versatile Laser System for the Production of Printed Circuit Boards
by Bernd Lange and Klaus Vollrath, LPKF Laser & Electronics AG |
Ultrafine Structuring of Flexible
Circuits
by Dr. Dieter J. Meier, LPKF Laser & Electronics AG |
Laser Supported Activation and Additive Metallization of Thermoplastics for 3D-MID's
by Mark Hueske, LPKF Laser & Electronics AG and others
Published at the 3rd LANE Conference 2001, Erlangen, Germany |
A Fundamentally New Mechanism for Additive Metallization of Polymeric Substrates in Ultra Fine Line Technology illustrated for 3D-MID's
by Prof. G. Naundorf and Prof. H. Wissbrock, University of Applied Sciences, Lemgo, Germany
Published in Galvanotechnik September 2000 |
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