Laser Depaneling – Closer to the Edge
The LPKF MicroLine 6120 S helps to significantly improve the process control in PCB depaneling operations: The laser process keeps delicate components, soldered connections and sensitive board materials free from any mechanical load. At the same time the LPKF Microline 6000 S produces more boards per panel by cutting with superior precision: Components can be placed right next to the edge of the board. Fixing areas are not required.
Stress-Free Cutting of Populated Boards
The LPKF MicroLine 6120 S is ideal for separating single boards from a larger panel by dust free cuts in flexible, thin rigid and rigid-flexible materials. The need for accurate board outlines turns from a challenge into an advantage. The system features by default a clearance between the laser head and the substrate surface of 30mm, on a large working area of 610 x 457 mm (24” x 18”). This allows for processing single or double sided boards populated with surface mount devices (SMD). The novel production-ready design provides simple integration into the production line.
Fast Return on Investment
Tooling expenses and costly fixturing for die-cutting and other conventional methods can be eliminated as soon as production with the LPKF MicroLine 6120 S begins. Fast and simple set-up for a variety of products contributes to reduced production expenditures. Due to the noncontact process, standard SMT carriers can be used throughout the whole production process. Significant yield improvements also help to cut costs. Turn-around times for PCB prototypes are much faster than traditional methods. The focus spot of the laser beam is ideal for very narrow cut channels, and very small radii. This saves space and material.
LPKF MicroLine users all over the world enjoy the quick link to our application centers in Germany, the United States and China. There they receive support for new projects, new processes, and applications based on LPKF’s years of experience in laser material processing. Training for your operating staff and technical service completes the beneficial relationship with the world leader in PCB laser cutting.
Depaneling of Assembled Boards
Laser technology opens up new perspectives for the production of sensitive boards. The LPKF MicroLine
6000 S is ideal for cutting break-out tabs and complex contours in rigid, rigid-flex and flexible PCB substrates – thin materials in particular. The system provides clean, burr-free cuts in FR4, FR5, and CEM materials – approximately 1 mm material thickness is cut in one pass. Further materials include: ceramics, polyimides and polyesters.
Sensitive, Accurate Process
The non-contact process prevents mechanical deformation – the laser beam singulates boards Keeping delicate circuits safe. Micro cracks or delamination effects are no longer an issue; as well as dust/chips on the board or burr formations. The LPKF MicroLine 6120 S allows for optimum yield and helps to meet tight tolerances with perfect accuracy.
Arbitrary Shapes, Narrow Cuts
The laser cuts virtually any shape with minimal spaces between the single PCBs. Densely populated boards
and closely arranged panels provide for an increased net usable surface. Clamping or fixtures are not required because the only mechanical-dynamic forces acting on the boards are associated with the handling equipment.
Efficient High Quality Production
Changeover times and time-to-market are no longer dependent on tools and adapters; only the layout data has to be uploaded. The MicroLine 6120 S is especially suitable for small, sensitive PCBs with narrow spaces on the panel – for increased operational capacity at a better quality.
- Maximum throughput
- Easy operation
- 30 mm default clearance above substrate
Constant Scan Technology for Maximum Throughput
Cutting while moving the scanning head – the Constant Scan Technology eliminates unproductive down time. Integrating a powerful UV laser source and a high speed linear positioning system the LPKF MicroLine 6120 S delivers unique throughput.
Production Ready Right Away
The MicroLine 6120 S is prepared with integrated feeders and SMEMA-compatible interfaces. The gantry architecture allows for transportation of the applications through the machine via conveyor handling or byoperating a load/unload unit.
The material evaporated by the laser energy is efficiently removed by LPKF’s special exhaust system to leave no residues behind on the board, and to avoid pollution in the work environment. Particles are kept clear of the system’s optics to reduce the frequency of maintenance.
Easy Machine Control
The data handling is very convenient and reduces changeover time to a minimum. Parameters are easy to choose with intuitive menu driven software (all common data formats are supported).
Process-Integrated Quality Assurance
A new drift compensated scanning head and an automatic adjustment function based on an optional power sensor ensure high process stability for the LPKF MicroLine 6120 S. Due to the high process stability the system is cutting with controlled depths.
Integration in Manufacturing Execution Systems (MES)
The LPKF MicroLine 6120 S includes interfaces for integration in an overall MES infrastructure. This supports the collection of operational data, machine assignment, Tracking & Tracing, as well as product-routing.