Rigid-flex material
The LPKF MicroLine UV laser systems cleanly cut any circuit board material normally used for manufacturing circuits or parts. The combination of flex and rigid material is especially easy in one job. Registration problems and burr formation are eliminated.
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 Depaneling of a rigid-flex PCB |
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Cutting of rigid PCB material
The LPKF MicroLine UV Laser systems are suitable for material thickness up to 1 mm (0.040 inch). Since LPKF uses a new generation of UV laser sources in combination with special designed laser optics, the burr formation is reduced to a minimum. The result is a precise cut with smooth, vertical edges.
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Inner contour cut in FR4-Multilayer |
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| Cutting of flexible circuits in arbitrary shapes |
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| Cutting cover layers |
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Drilling flex material
The LPKF MicroLine UV laser systems precisely drill 75 µm through-holes with perfect geometry in flexible multilayer material
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Depaneling of a rigid-flex PCB |
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Embedding chips
The LPKF MicroLine UV laser systems provide excellent pocket registration. Small pockets can be produced with virtually no radii in the edge floor to wall and with a depth tolerance of less than +/- 25 microns. |
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100 µm deep pockets in copper plated FR4 |
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Structuring / repair of solder-resists
The LPKF MicroLine UV laser systems are suitable for the most ambitious opening of solder-resists in the HDI range <50 µm. Solder mask defects can be easily fixed by laser exposing of pads and traces |
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100 µm deep pockets in copper plated FR4 |
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| Removing laminated cover layers without leaving residue on the metal surface |
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| Removing organic and metal etch resist for micro line etching |
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