North America
MicroLine 2000 Ci

MicroLine 2000 Ci

Download PDF Datasheet Here Versatile, affordable, inline laser depaneling

The LPKF MicroLine 2000 Ci is ideal for anyone who needs a versatile, efficient depaneling method. Powered by UV lasers that make clean, burr-free cuts, MicroLine 2000 Ci systems eliminate mechanical stress and greatly limit thermal stress. This makes the MicroLine 2000 Ci perfect for depaneling any substrate - from FR4 to ceramics, polyesters, and more. In particular the MicroLine 2000 Ci demonstrates its superiority when handling flexible materials such as polyimide.

The MicroLine 2000 Ci can be customized to fit your applications. Its inline chassis and can be equipped with either a 10 or 15 watt laser source. A built-in exhaust unit removes all material evaporated by the laser energy, ensuring board surfaces are residue-free.

Cutting of flex circuits in arbitrary shapesCutting of flex circuits in arbitrary shapes Cutting rigid PCB materialsCutting rigid PCB materials Cutting rigid-flex materialsCutting rigid-flex materials
Cutting cover layersCutting cover layers Drilling flex materialsDrilling flex materials Pocket creation for embedding chipsPocket creation for embedding chips
Repairing solder resistsRepairing solder resists Removal of organic and metal etch resistsRemoval of organic and metal etch resists Removing laminated cover layersRemoving laminated cover layers
Stand-alone systemStand-alone system Inline systemInline system System interiorSystem interior
Mechanical stress and PCB depanelingMechanical stress and PCB depaneling

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