Laser Depaneling
MicroLine 1120 S
MicroLine 6120 S
PCB Laser Processing
Articles & Publications
Service Suppliers
Webinars
Winner 2011 Global Technology Awards

MicroLine 1120 S

Low Cost Option for Depaneling
 
Specifications
       
Technical Data: MicroLine 1120 S
Max. layout area 9.8” x 13.8” x 0.4” (250 x 350 x 10 mm)
Laser wavelength 355 nm
Power 5 W
Diameter of Focused Laser Beam 20 µm (0.8 mil)
Dimensions (L x W x H) 34.5” x 29.5” x 56.3” (875 x 750 x 1,430 mm)
Weight 573 lbs (260 kg)
Operating Data
Power Supply 110/230V 50-60Hz, 1.4kW
Cooling Air-cooled (internal cooling cycle)
Ambient temperature 68°F ± 4°F (22°C ± 2°C)
Accessories Required 71.6°F ± 4°F (22°C ± 2°C)