Laser Depaneling of Populated PCBs
The MicroLine 1120 S and 6120 S are UV laser systems designed for depaneling populated PCBs. Ideal for cutting break-out tabs and complex contours at the highest accuracy, the laser demonstrates its superiority over conventional cutting systems when handling rigid and flexible substrates in particular. The UV laser is capable of cutting board outlines which are immediately adjacent to delicate components and tracks without causing any of the mechanical stress associated with routers or dicing saws. This allows small subassemblies with much higher densities to be realized, with components right up to the edge of the printed circuit board.
Benefits of these systems not only include the ability to cut a wide variety of substrates with superior cut quality than conventional methods, but also at a cost which makes for a short ROI term and simple scalability by adding multiple systems side-by-side. The tool-less method also makes any contour possible and changes to the cutting paths are easily altered either through the included CircuitMaster software or within your preferred CAD package.
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