North America
1-800-345-LPKF

UV Laser Depaneling Systems


The LPKF MicroLine family of laser depaneling systems is ideal for cutting out populated or bare circuits. Precise UV laser beams eliminate mechanical stress and reduce thermal stress. This allows small subassemblies with higher densities to be realized and elminates problems such as damaged components. LPKF MicroLine systems can cut any rigid, flexible, or rigid-flex substrate.