| Maximum panel size |
229 mm x 305 mm (9" x 12") |
| Maximum working area of UV exposing unit |
240 mm x 340 mm (9.5" x 13") |
| Base material types |
FR4, FR3, RO 3000, RO 4000, etc. |
| Processing time |
approximately 60 minutes |
| PAD separation |
Min. 0.5 mm (20 mil) fine pitch |
| Peel strength |
Class H and T
testing method: IPC-SM-840 C, Subsection 3.5.2.1 |
| Solder bath resistance |
20 sec at 265 °C (509 °F), testing method: IPC-SM-840 C, Subsection 3.7.2
10 sec at 288 °C (550 °F), testing method: MIL-P 55 110 D
20 sec at 288 °C (550 °F), testing method: UL 94 (lead-free) |
| Surface resistance |
20 kΩ, testing method: VDE 0303, Section 30, DIN IEC 93 |
| Moisture resistance and isolation resistance |
Class H and T, testing method: IPC-SM-840 C, Subsection 3.9.1 |
| Solvent / Cleaning agent stability |
IPC-SM-840 C, Pkt. 3.6.1 |
| Hardware requirements |
600 dpi laser printer |
| Software requirements |
CircuitCAM 5.0 or higher |
