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Lead-Free Solder Paste

SN100C NL900
 
Specifications
     
Printing Parameters Value
Viscosity (measured @ 25C using Brookfield Viscometer) 700 – 850 Kcps
Print Speed 20 – 100 mm/sec.
Squeegee Blade 80 to 90 diameter or stainless steel
Stencil Material Stainless steel, Molybdenum, brass, Nickel Plated
Temperature/Humidity Optimal ranges are 70 - 77°F and 35 – 65% RH
   
Performance Parameters Value
Stencil Life (25C @ 45% RH) +24 Hours
Tack Life +48 Hours
Tack Force 1.6 grams/mm2
Slump  
Room Temp., 1 hour  
0.7 mm pads 0.2 mm
1.5 mm pads 0.2 mm
80°C, 20 minutes  
0.7 mm pads 0.2 mm
Note: Slump is expressed as the minimum spacing between pads that do not allow bridging
Abandon Time  
Pitch  
20 mil and greater >4 Hours
16 mil and less (10 mil aperture) 2 Hours
(8 mil or less aperture) 1 Hour
Flux Activity (per ANSI/J-STD-006) ROL0
Copper Mirror (per IPC-J-STD-004) Pass
Copper Plate Corrosion (per ANSI/J-STD-004) Pass
Typical SIR, IPC @ 96 hours (per IPC-J-STD-004) Pass (>2.0 x 10-9 ohms)
Typical SIR, IPC @ 168 hours (per IPC-J-STD-004) Pass (>1.5 x 10-8 ohms)