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Why LPKF
 
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ZelPlace BGA
Semi-automatic placement of BGA components
 
Specifications
   
Max. PCB size 220 mm x 300 mm (8.6“ x 11.8“)
Max. size of components 45 mm x 45 mm (1.8“ x 1.8“)
Min. size of components 5 mm x 5 mm (0.2“ x 0.2“)
Pitch 0.3 mm (12 mil)
Placement accuracy ±50 μm (±2 mil)
Power supply 230 V/50 Hz oder 115 V/60 Hz, 20 VA
Compressed air 6 bar (87 psi), min. 5 l/min (0.18 cfm), oil-free
Dimensions (W/H/D) 600 mm x 430 mm x 435 mm (23.6“ x 17“ x 17.1“)
Weight 35 kg (77 lb)